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Home > Achievements > Inter-School > News |
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Intel International Science and Engineering Fair 2010 2010-05-09 Chung Tin Lok of 3D was selected as Finalist to represent Hong Kong to attend The 61th Intel International Science and Engineering Fair(ISEF) with his project, CryptoDefender: A smart way to protect your file, San Jose, USA.
#Information and Communication Technology #ISEF Views: 11218 |
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