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Hong Kong Youth Science and Technology Invention Competition 2006-2007 2007-04-01

Congratulations to Lau Tak Kin, Lau Tak Shing of 2D and Wong Cheuk Hang of 3D. They have won the First Class Award with their invention 'Anti-Bump Lock' (防撞鎖)in the Hong Kong Youth Science and Technology Invention Competition 2006-2007 (香港青少年科技創新大賽).










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